DesignCon 2011 On-Chip Characterization of Signal and Power Integrity in 3-D Packaged Systems
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چکیده
Characterization of I/O channels, signal quality, and supply noise in 3-D packaged systems is very challenging due to the small footprint and complex 3-D interaction. This paper presents several enabling techniques to allow on-chip signal and power integrity characterization for the 3-D packaged systems. They provide comprehensive in-situ characterization capabilities for measuring overall link margins, capturing signal waveforms, characterizing supply noise and its impact, and measuring power delivery network (PDN). These techniques are demonstrated in a low-power memory test system realized in Package-on-Package (POP) environment, with good correlation between the measurement data and simulation results.
منابع مشابه
DesignCon 2010 Power Integrity and Noise Coupling Effects on Signal Integrity – Methodology for Identifying the Deterministic Jitter Components and their Generating Sources in Data Communication Systems
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تاریخ انتشار 2010